E lectronic ceramic components are equipped with many ideal properties for different applications in power electronics. These are frequentl...
What are the inspection methods used for quality control of Electronic Ceramic Components?
What are the inspection methods used for quality control of Electronic Ceramic Components?
Electronic ceramic components are equipped with many ideal properties for different applications in power electronics. These are frequently used in manufacturing many kinds of equipment for medicine, machinery, electronic appliances, and many other industries. The ceramics are used in circuit boards and are primarily responsible for ensuring the machine’s proper functioning. Electronic ceramic components offer a higher conductivity, making the material ideal for various applications in communication systems, aircraft circuit boards, satellite technology, wireless devices, and more. However, with rapid IT innovations, the quality control for these components has become much more challenging.
Following are the various inspection methods used for quality control of electronic ceramic components:
Visual inspection
Visual inspection is the primary quality control method used for every type of electronic appliance to determine if there are any visible defects in the electronic appliances or parts. An InterCEPT certified inspector inspects the packaging and labels on the electronic component for a detailed visual examination for any typos, fake numbering, blacktopping, and many other such indicators.
X-Ray testing
If the visual inspection does not reveal any discrepancies, next, X-Ray inspection is used to verify the inner workings and structure of the electronic ceramic components. If there are any defects, unusual size, exceeding quantity, or indication of tempering, it will be revealed through X-ray testing. The images of the component can be compared with the images of the original parts to detect any counterfeits.
Decapsulation
Sometimes even X-Ray testing cannot give conclusive results. Thus, additional testing such as failure analysis testing techniques is used to verify the authenticity of the electronic ceramic parts. Decapsulation is a destructive test that is usually performed on a sample component using failure analysis (FA), constructional analysis (CA), and destructive physical analysis (DPA) techniques. In decapsulation, an internal visual inspection is first conducted using a high-powered microscope to verify the manufacturer’s markings, defects, typography, part numbers, mechanical accuracy, and authenticity. Next, chemical etching methods are used to verify each component used in the manufacturing.
There are many different types of decapsulation methods used for different kinds of electronic device components, depending on their application purposes. Various chemicals (such as sulfur acid, nitric acid, etc.) are used for decapsulation, rendering the sample unusable in most cases since it is a destructive testing method. Therefore, it is usually performed after radiography, external visual examination, leak check, and other inspection testings as required depending on the component to ensure its authenticity. If the sample fails the analysis, the whole batch will need to be discarded.
The electronic ceramic component inspections can be conducted by your in-house certified team or a certified third-party provider offering reliable visual, x-ray, and decapsulation testing services. If you lack the in-house quality control capabilities, get in touch with our team for reliable inspection services to meet all your needs.
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